Canadian Phone number works in Germany (905) 488-5693 (In Germany till May, 2011)
Email: peter_kataria@yahoo.com
Citizenship: Canadian OBJECTIVE Engineering/Related position where I can use my versatile background in Engineering as well as in Chemistry.
PROFESSIONAL EXPERIENCE Senior Process Engineer, Lotus Systems, Germany 01/ 11 to 05 / 2011
Qualified the equipment for texturization of Mono Crystalline Silicon wafer by controlling IPA and KOH concentration, temperature and time under vacuumed conditions.
Maintained refraction value with in limit after texturization process.
Performed Pyramid size, by SEM after etching process.
Qualified the equipment for Silicon Chunk Cleaning by HF/HNO3.
Qualified the equipment for wafer cleaning after wire saw process by controlling temperature, flow rate, and vacuum pressure.
Performing research on Poly Vinyl Alcohol, to replace Iso Propyl Alcohol for better texturization process.
Defining concentration of Poly Vinyl Alcohol and KOH for maximum Etch rate for texturization of Mono Crystalline Solar wafers.
Performing refraction value after etching by refractometer. Senior Process Engineer, YSolars, Suzhou, China. 10/09—09/10(Contract position)
Worked as a senior process engineer in the manufacturing of CIGS Thin film solar cell.
Defined equipment requirement for CdS deposition that works as a buffer layer between CIGS and Zno, which is integral part of efficiency of the solar cell.
Defined procedure for CdS chemical bath deposition, in CIGS thin film solar cell, that includes concentration of each chemical, Ph, flow rate and temperature.
Interacted with vendors on weekly basis for technical issues.
Defined CdS layer properties that include Band Gap energy, resistivity, sheet resistance, and thickness of the CdS film.
Supervising Engineers and Technicians for the maximum productivity.
Supervised chemistry lab for chemical analysis of the raw material.
Reported Project Report on weekly basis.
Defined equipment requirements and process for Alkaline cleaner, to clean the substrate before sputtering process.
Defined equipment requirements and Process for waste water treatment, to remove Cadmium, Thio urea and Ammonia from the waste water after CdS process.
Supported back contact area for the manufacturing of Solar Module.
Provided documentation for FAT (Factory Acceptance Test) and SAT (Site Acceptance Test) for Alkaline Cleaner, CdS chemical bath deposition, and waste water treatment. Senior Process Engineer, Lam Research, Fremont, CA. 06/03-04/09
Responsible for performing Chemical Mechanical Planarization on 200mm and 300mm wafers in Dielectric area.
Responsible for controlling removal rates, within and wafer to wafer uniformity, step height, &dishing on incoming wafers by performing CMP process followed by using Tencor.
Responsible for controlling trench oxide, active silicon nitride, and field oxide on incoming STI wafers byperforming CMP process by controlling, slurry flow rate, down force, belt speed and air pressure zones as per customer requirements.
Participated in promoting continuous process improvement by Statistical Process Control and in development of consumable, slurry, conditioning disk, pads to minimize defects such as scratches, planarity, and particles after CMP process.
Supervised engineering technician for chemical analysis as required for different processes.
Interfaced with equipment engineering and manufacturing for concurrent development.
Interpreted and deducting data to write demo reports Sr. Development/Process Engineer, BP Solar, Fairfield, CA USA. 04/98-03/03
Leaded/Planed projects to implement necessary changes in methods, machine used lay out process etc to simplify the manufacturing process etc. reduce costs and to ensured optimum product design.
Provided Standard Operating Procedure manuals for each major process. Each manual included maintenance requirement, technical data, process flow diagram, process chemistry, duties of supervisors and operators, Bill of Material etc.
Participated in evaluation and selection of vendors and equipment manufacturers.
Worked closely with quality assurance, production & maintenance to identify & resolve problems when statistical process control limits are reached.
Supported Lamination Process for EVA film on the module.
Provided Technical Process Support including training, process trouble shooting, shut down and start up, and equipment related problem.
Developed and maintained fabrication processes such as Photo resist coating, Carbon Coating, UV Cure of photo resist, cadmium chloride doping, copper Iodide doping, Heat Treatment, and testing of Solar Panels.
Supervised engineering technician for chemical analysis as required for different processes
Promoted continuous process improvement by statistical Process Control (SPC).
Interfaced with equipment engineering and manufacturing for concurrent development. . Manufacturing Engineer, Headway Technology-Milpitas, CA. USA 02/97-04/1998
Sustained and resolved problems in Etching/Striping/Plating area.
Responsible for thin film deposition of Ni-Fe, HMM, Cu, and Au on DSMR and GMR wafers.
Responsible for etching of Ni-Fe layer by Field etch, AP etch for Cu seed layer, and EDTA etch for Alumina by etchant preparation and by performing etch rate/etched surface monitor.
Supervised engineering technician for chemical analysis as required for different processes.
Responsible for final disposition of wafers by performing corrective action for defects such as resist residue, under etch/over etch , fencing, metal redep, fencing, rainbow, corrosion, oxidation,etc.
Interfaced with equipment engineering and manufacturing for concurrent development.
Coordinated product failure analysis (FA) by reviewing process capability measurements and Instrumentation.
Promoted continuous process improvement by statistical Process Control. Process Engineer, Akashic Memories Corporation - Milpitas CA. USA 04/92-02/97
Sustained Electroless Nickel Plating lines for deposition of Nickel on Aluminum substrate used for subsequent deposition of magnetic media that is used in hard drives.
Designed experiments for reducing defects like pits, bumps, edge pullback, nodules, flatness ID/OD, chemicalstains, chemical etch to improve yields.
Promoted continuous process improvement by Statistical Process control and by monitoring automation control such as replensihers, level controllers, laboratory instrumentation and other peripheral equipment.
Interfaced with equipment engineering and manufacturing for maximizing productivity.
Coordinated product failure analysis by reviewing process capability measurement instrumentation.
Coordinated environmental issues that cause the defects in the final product.
Supported chemical mechanical polishing (CMP) of Nickel along with plating process.
Monitored flow rate, pH & concentration of slurry for chemical mechanical polishing (CMP) process.
Monitored flatness by using Minifiz, thickness by XRF, roughness (Ra) by zygo instrumentation after chemicalmechanical polishing (CMP) process.
Worked closely with quality assurance, production & maintenance to identify & resolve problems when statistical process control limits are reached. Chemist, Novopharm Pharmaceutical Ltd., - Toronto, Ontario, Canada. 02/87-12/89
Sampled and tested incoming raw material by wet chemistry by following FDA methods.
Prepared solutions and reagents and analyzed by HPLC and GC.
Interpreted and deducted data to write reports.
Generated and documented standard operating procedures (SOP’s) for sampling of raw materials. EDUCATIONAL QUALIFICATIONS Bachelor of Science, Chemistry Major 01/90-02/92 University of Guelph,, Guelph, Ontario, Canada. Chemical Engineering Technologist, Industrial Major 12/83-12/86 Centennial College, Toronto, Ontario, Canada.
